期刊的影响因子--文章列表

期刊文章列表
郭如梦^1,2，肖宇博^1,3，高悦¹，周士祺¹，刘洋³，刘志权^1,2（Shenzhen Institute of Advanced Electronic MaterialsShenzhen Institute of Advanced TechnologyChinese Academy of Sciences；Shenzhen College of Advanced TechnologyUniversity of Chinese Academy of Sciences；School of Material Science and EngineeringHarbin University of Science and Technology）.Interfacial enhancement of Ag and Cu particles sintering using (111)-oriented nanotwinned Cu as substrate for die-attachment[J].China Welding,2022,第1期首页上一页 1 2 尾页共有2页，转到页

期刊文章列表