期刊的影响因子--文章列表

期刊文章列表
WANG Tengda(王腾达)，WU Wenjun，YANG Feng，SUN Teng，GAO Qiang（Faculty of Information Technology,Beijing University of Technology；The 54th Research Institute of CETC）.A greedy path planning algorithm based on pre-path-planning and real-time-conflict for multiple automated guided vehicles in large-scale outdoor scenarios^①[J].High Technology Letters,2023,第3期 XIAO Zhifang(肖志芳)，ZHONGGuoxuan，CHEN Jianqi，GUOChen，PENG Shuo（School of Electronic and Information Engineering, Jinggangshan University；Jiangxi Engineering Laboratory of IoT Technologies for Crop Growth）.The relationship between extra connectivity and t/k-diagnosability under the PMC model^①[J].High Technology Letters,2023,第3期 ZHANG Xingguo(张兴国)，HU Binghua，WANG Yuanliang，YAN Hui，MA Xiaodong，GE Quanbo（School of Computing,Northwestern Polytechnical University；Test Technology Institute,Chinese Flight Test Establishment；School of Logistics Engineering,Shanghai Maritime University；College of Automation,Nanjing University of Information Science Technology）.In-flight deformation measurement for high-aspect-ratio wing based on 3D speckle correlation^①[J].High Technology Letters,2023,第3期 LIU Wenbin(刘文斌)，HE Yanqing，LAN Tian，WU Zhenfeng（Research Center for Information Science Theory and Methodology, Institute of Scientific and Technical Information of China）.Research on system combination of machine translation based on Transformer^①[J].High Technology Letters,2023,第3期 LIU Yang(刘洋)，HE Jinglin，WANG Bin，ZHANG Yuzhi（College of Communication and Information Engineering, Xi’an University of Science and Technology；Xi’an Key Laboratory of Network Convergence Communication, Xi’an University of Science and Technology）.Design of two-dimensional spatially coupled LDPC codes for combating burst erasures^①[J].High Technology Letters,2023,第3期肖志芳¹，ZHONG Guoxuan²，CHEN Jianqi¹，GUO Chen^1,2，PENG Shuo¹（School of Electronic and Information Engineering，Jinggangshan University；Jiangxi Engineering Laboratory of IoT Technologies for Crop Growth）.The relationship between extra connectivity and t/k-diagnosability under the PMC model[J].High Technology Letters,2023,第3期刘文斌，HE Yanqing，LAN Tian，WU Zhenfeng（Research Center for Information Science Theory and Methodology，Institute of Scientific andTechnical Information of China）.Research on system combination of machine translation based on Transformer[J].High Technology Letters,2023,第3期刘洋，HE Jinglin，WANG Bin，ZHANG Yuzhi（College of Communication and Information Engineering，Xi’an University of Science andTechnology；Xi’an Key Laboratory of Network Convergence Communication，Xi’an University of Science andTechnology）.Design of two-dimensional spatially coupled LDPC codes for combating burst erasures[J].High Technology Letters,2023,第3期陈雷¹，CAO Peilin²，BAI Jinghao¹，ZHANG Ting³（Computer School，Beijing Information Science and Technology University；College of Economics and Management，Beijng University of Technology；Faculty of Information Technology，Beijing University of Technology）.A wireless geophone based on STM32[J].High Technology Letters,2023,第3期金凯琦，WU Wenjun，GAO Yang，YIN Yufen，SI Pengbo（Faculty of Information Technology，Beijing University of Technology）.Deep reinforcement learning based task offloading in blockchain enabled smart city[J].High Technology Letters,2023,第3期 KONG Deshun(孔德顺)，GAO Xiangsheng，JIANG Huizeng（Institute of Standard Metrology,China Academy of Railway Sciences Corporation Limited；Beijing Huaheng Technology Co. Ltd.；Key Laboratory of Advanced Manufacturing Technology,Beijing University of Technology；Hebei Changxiang Rubber Plastic Technology Co. Ltd.）.Research and experimental analysis of precision degradation method based on the ball screw mechanism^①[J].High Technology Letters,2023,第3期王东，LI Guizhi，SUN Xiaojing，WANG Changqing（Army Academy of Artillery and Air Defense）.Joint UAV 3D deployment and sensor power allocation for energy-efficient and secure data collection[J].High Technology Letters,2023,第3期孙远韬¹，ZHANG Min¹，YUAN Lindong²（School of Mechanical Engineering，Tongji University；Metering Department，Shanghai，Fiorenti Gas Equipment CO，.LTD）.Experimental study on the failure factors of the O-ring for long-term working[J].High Technology Letters,2023,第3期孔德顺^1,2，GAO Xiangsheng^3,4，JIANG Huizeng^1,2（Institute of Standard Metrology，China Academy of Railway Sciences Corporation Limited；Beijing Huaheng Technology Co.Ltd.；Key Laboratory of Advanced Manufacturing Technology，Beijing University of Technology；Hebei Changxiang Rubber Plastic Technology Co.Ltd.）.Research and experimental analysis of precision degradation method based on the ball screw mechanism[J].High Technology Letters,2023,第3期彭斐，CHEN Shudong，QI Donglin，YU Yong，TONG Da（Institute of Microelectronics of the Chinese Academy of Sciences；University of Chinese Academy of Sciences）.Semantic-aware graph convolution network on multi-hop paths for link prediction[J].High Technology Letters,2023,第3期 SUN Yuantao(孙远韬)，ZHANG Min，YUANLindong（School of Mechanical Engineering,Tongji University；Metering Department,Shanghai,Fiorenti Gas Equipment CO,.LTD）.Experimental study on the failure factors of the O-ring for long-term working^①[J].High Technology Letters,2023,第3期吴振峰¹，WANG Mengmeng²，LAN Tian¹，ZHANG Anyuan³（Institute of Scientific and Technical Information of China；School of Economics,Renmin University of China；Shandong Provincial Center for Quality Control of Feed and Veterinary Drug）.GHM-FKNN：a generalized Heronian mean based fuzzy k-nearest neighbor classifier for the stock trend prediction[J].High Technology Letters,2023,第2期张伟，ZHAO Dingxuan，GONG Mingde（School of Mechanical Engineering,Yanshan University；Key Laboratory of Special Carrier Equipment of Hebei Province,Yanshan University）.Output feedback control and parameters influence analysis of active suspension electro-hydraulic servo actuator[J].High Technology Letters,2023,第2期吴进，PANG Wenting，WANG Lei，ZHAO Bo（School of Electronic Engineering,Xi’an University of Posts and Telecommunications）.Micro-expression recognition algorithm based on graph convolutional network and Transformer model[J].High Technology Letters,2023,第2期谭惠，DUAN Yong（School of Information Science Engineering,Shenyang University of Technology）.Prediction of users online purchase behavior based on selective ensemble learning[J].High Technology Letters,2023,第2期王伟峰，YANG Bo，LIU Hanfei，QIN Xuebin（School of Safety Science and Engineering，Xi’an University of Science and Technology；School of Electrical and Control Engineering，Xi’an University of Science and Technology）.Vehicle recognition and tracking based on simulated annealing chaotic particle swarm optimization-Gauss particle filter algorithm[J].High Technology Letters,2023,第2期 TAN Hui(谭惠)，DUAN Yong（School of In formation Science Engineering, Shenyang University of Technology）.Prediction of users online purchase behavior based on selective ensemble learning^①[J].High Technology Letters,2023,第2期 ZHAO Qianqian(赵倩倩)，WU Hanxiao，HUANG Linhan，ZHU Jianqing，ZENG Huanqiang（College of Information Science and Engineering, Huaqiao University；College of Engineering, Huaqiao University；Xiamen Yealink Network Technology Company Limited）.Visible-infrared person re-identification using query related cluster^①[J].High Technology Letters,2023,第2期陈瑞¹，TONG Ying¹，ZHANG Yiye²，XU Bo²（College of Information & Communication Engineering,Nanjing Institute of Technology；Jiangsu Future Network Innovation Research Institute）.Video expression recognition based on frame-level attention mechanism[J].High Technology Letters,2023,第2期张梦莹，YANG Xiumei，BU Zhiyong（Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences；University of Chinese Academy of Sciences）.Resource allocation for uplink grant-free access in beam-hopping based LEO satellite systems[J].High Technology Letters,2023,第2期张进杰¹，SONG Chunyu¹，LEI Fuchang¹，WANG Yao¹，ZHI Haifeng²，LIU Fengchun²（Beijing Key Laboratory of Health Monitoring and Self-Healing of High-end Mechanical Equipment,Beijing University of Chemical Technology；China North Engine Research Institute (Tianjin)）.Research on the dynamic response of connecting rod bearing bush wear of reciprocating machine under variable working conditions[J].High Technology Letters,2023,第2期冯雪林^1,2,3，SHI Jinglin¹，CHEN Yang¹，FU Yanlu³，ZHANG Qineng¹，XIAO Feng³（Beijing Key Laboratory of Mobile Computing and Pervasive Device,Institute of Computing Technology，Chinese Academy of Sciences；School of Computer Science and Technology,University of Chinese Academy of Sciences；Beijing Sylincom Technology Co.Ltd.）.A TSE based design for MMSE and QRD of MIMO systems based on ASIP[J].High Technology Letters,2023,第2期张之政^1,2,3，GUO Mingqiang^1,2,3，WU Liang^2,3，HUANG Ying⁴，CHEN Xueye¹（Key Laboratory of Urban Land Resources Monitoring and Simulation，Ministry of Natural Resources；National Engineering Research Center of Geographic Information System,China University of Geosciences；School of Computer Science,China University of Geosciences；Wuhan Zondy Cyber Technology Co.Ltd.）.Paired regions for shadow removal approach based on multi-features[J].High Technology Letters,2023,第2期尹玉峰，WU Wenjun，GAO Yang，JIN Kaiqi，ZHANG Yanhua，SUN Teng（Faculty of Information Technology,Beijing University of Technology）.Joint optimization of serving node selection and wireless resources allocation for transactions data in mobile blockchain enhanced Internet of Things[J].High Technology Letters,2023,第2期赵倩倩¹，WU Hanxiao¹，HUANG Linhan²，ZHU Jianqing^2,3，ZENG Huanqiang²（College of Information Science and Engineering,Huaqiao University；College of Engineering,Huaqiao University；Xiamen Yealink Network Technology Company Limited）.Visible-infrared person re-identification using query related cluster[J].High Technology Letters,2023,第2期首页上一页 1 2 3 下一页尾页共有3页，转到页

期刊文章列表