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Yuan Liu，Hongwei Zhou，Peng Xue，Linhan Lin，Hong-Bo Sun（State Key Laboratory of Precision Measurement Technology and Instruments；Beijing Computational Science Research Center；State Key Laboratory of Integrated Optoelectronics）.Photoswitchable quantum electrodynamics in a hybrid plasmonic quantum emitter[J].芯片(英文),2023,第3期
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Yan Li，Zhiling Wang，Zenghui Bao，Yukai Wu，Jiahui Wang，Jize Yang，Haonan Xiong，Yipu Song，Hongyi Zhang，Luming Duan（Center for Quantum Information；Hefei National Laboratory）.Frequency-tunable microwave quantum light source based on superconducting quantum circuits[J].芯片(英文),2023,第3期
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Fei Pan，Kaiyu Cui，Yidong Huang，Ziming Chen，Ning Wu，Guoren Bai，Zhilei Huang，Xue Feng，Fang Liu，&，Wei Zhang（Department of Electronic Engineering；Beijing National Research Center for Information Science and Tech-nology（BNRist））.Phonon lasing enhanced mass sensor with zeptogram resolution under ambient conditions[J].芯片(英文),2023,第3期
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Haorui Luo，Wenrui Hu，Yongxin Guo（Department of Electrical and Computer Engineering；National University of Singapore（Suzhou）Research Institute）.On large-signal modeling of GaN HEMTs：past，development and future[J].芯片(英文),2023,第3期
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Donglin Xie，Ruonan Yu，Gongfan Fang，Jiaqi Han，Jie Song，Zunlei Feng，Li Sun，Mingli Song（Key Laboratory of Visual Perception；School of Software Technology；Ningbo Innovation Center）.Federated selective aggregation for on-device knowledge amalgamation[J].芯片(英文),2023,第3期
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Haonan Chang，Jun Zhang（State Key Laboratory of Superlattices and Microstructures；Center of Mate-rials Science and Optoelectronics Engineering）.Refrigeration technologies of cryogenic chips[J].芯片(英文),2023,第3期
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Xiang Lan，Yingliang Cheng，Xiangdong Yang，Zhengwei Zhang（Hunan Key Laboratory of Nanophotonics and Devices；College of Ma-terials Science and Engineering；Institute of Micro/Nano Materials and Devices）.Wafer-scale engineering of two-dimensional transition metal dichalcogenides[J].芯片(英文),2023,第3期
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Mingjun Zhong，Jie Li，Yajie Zhang，Xin Li，Zhen Xu，Qian Shen，Xue Zhang，Yongfeng Wang（Center for Carbon-based Electronics and Key Laboratory for the Physics and Chemistry of Nanodevices；Spin-X Institute；Key Laboratory of Flexible Electronics（KLOFE）and Institute of Advanced Materials（IAM））.Construction and electrical control of ultrahigh-density organic memory arrays at cr yog enic temperature[J].芯片(英文),2023,第3期
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Takaya Sugiura，Kenta Yamamura，Yuta Watanabe，Shiun Yamakiri，Nobuhiko Nakano（Department of Electronics and Electrical Engineering）.Circuits and devices for standalone large-scale integration (LSI) chips and Internet of Things (IoT) applications：a review[J].芯片(英文),2023,第3期
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Jiawei Yang，Kaiyu Cui，Yidong Huang，Wei Zhang，Xue Feng，Fang Liu（Department of Electronic Engineering；Beijing National Research Center for Information Science and Technology（BNRist）；Bejing Academy of Quantum Information Science）.Deep-learning based on-chip rapid spectral imaging with high spatial resolution[J].芯片(英文),2023,第2期
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Wenkai Zhang，Xueyi Jiang，Wentao Gu，Junwei Cheng，Hailong Zhou，Jianji Dong，Dongmei Huang，Xinliang Zhang（Wuhan National Laboratory for Optoelectronics；Optics Valley Laboratory；The Hong Kong Polytechnic University Shenzhen Research Institute；Photonics Research Institute）.On-chip photonic spatial-temporal descrambler[J].芯片(英文),2023,第2期
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Richard Soref，Francesco De Leonardis（Engineering Department；Photonics Research Group）.Electric-field-induced quasi-phase-matched three-wave mixing in silicon-based superlattice-on-insulator integrated circuits[J].芯片(英文),2023,第2期
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Shiheng Yang，Jun Yin，Yueduo Liu，Zihao Zhu，Rongxin Bao，Jiahui Lin，Haoran Li，Qiang Li，Pui-In Mak，Rui P.Martins（School of Integrated Circuit Science and Engineering；State-Key Laboratory of Analog and Mixed-Signal VLSI/Institute of Microelectronics；On leave from Instituto Superior Técnico）.Ring-VCO-based phase-locked loops for clock generation–design considerations and state-of-the-art[J].芯片(英文),2023,第2期
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Hao Li，Ziheng Zhou，Yongzhi Zhao，Yue Li（Department of Electronic Engineering；The College of Physics and Information Engineering；Hebei Semiconductor Research Institute；Beijing National Research Center for Information Science and Technology）.Low-loss beam synthesizing network based on Epsilon-near-zero(ENZ)medium for on-chip antenna array[J].芯片(英文),2023,第2期
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Zhongwang Wang，Xuefan Zhou，Xiaochi Liu，Aocheng Qiu，Caifang Gao，Yahua Yuan，Yumei Jing，Dou Zhang，Wenwu Li，Hang Luo，Junhao Chu，Jian Sun（School of Physics and Electronics；State Key Laboratory of Powder Metallurgy；Shanghai Frontiers Science Research Base of Intelligent Optoelectronics and Perception；National Key Laboratory of Integrated Circuit Chips and Systems；Raith China）.Van der Waals ferroelectric transistors：the all-round artificial synapses for high-precision neuromorphic computing[J].芯片(英文),2023,第2期
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Yali Ma，Yiwen Li，He Wang，Mengke Wang，Jun Wang（Department of Chemistry）.High performance flexible photodetector based on 0D-2D perovskite heterostructure[J].芯片(英文),2023,第1期
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Yiqi Sun，Jiean Li，Sheng Li，Yongchang Jiang，Enze Wan，Jiahan Zhang，Yi Shi，Lijia Pan（School of Electronic Science and Engineering；School of Microelectronics and Control Engineering；School of Computer Sci-ence and Engineering）.Advanced synaptic devices and their applications in biomimetic sensory neural system[J].芯片(英文),2023,第1期
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Luming Wang，Pengcheng Zhang，Zuheng Liu，Zenghui Wang，Rui Yang（Institute of Fundamental and Frontier Sciences；University of Michigan-Shanghai Jiao Tong University Joint Institute；School of Electronic Information and Electrical En-gineering；State Key Laboratory of Electronic Thin Films and Integrated Devices）.On-chip mechanical computing：status,challenges,and opportunities[J].芯片(英文),2023,第1期
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Yongqiang Du，Xun Zhu，Xin Hua，Zhengeng Zhao，Xiao Hu，Yi Qian，Xi Xiao，Kejin Wei（Guangxi Key Laboratory for Relativistic Astrophysics；National In-formation Optoelectronics Innovation Center（NOEIC）；State Key Laboratory of Optical Communication Technologies and Networks）.Silicon-based decoder for polarization-encoding quantum key distribution[J].芯片(英文),2023,第1期
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Yu Guo，Shuming Cheng，Xiao-Min Hu，Bi-Heng Liu，Yun-Feng Huang，Chuan-Feng Li，Guang-Can Guo（CAS Key Laboratory of Quantum Information；CAS Center For Excellence in Quan-tum Information and Quantum Physics；The Department of Control Science and Engineer-ing；Shanghai Institute of Intelligent Science and Technology；Institute for Advanced Study）.Experimental investigation of measurement incompatibility of mutually unbiased bases[J].芯片(英文),2023,第1期
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